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Electronics

  • Bond pad

  • Circuit

  • Cross section solar cell

  • Intermetallic connection

  • Metal lines

  • Micro electronic structure 1

  • Micro electronic structure 2

  • Micro electronic structure 3

  • Semiconductor 1

  • Semiconductor 2

  • Semiconductor 3

  • Semiconductor 4

  • Soldered lead

  • Surface solar cell

  • Tin whisker

  • 3D reconstruction of a micro electronic structure

P.2010

14th International Scientific Conference on Polymeric Materials

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HT-CMC7

September 20 - 22, 2010 Bayreuth, Bavaria, Germany

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ILMAC

ILMAC 2010 - hall 1.1, booth A45

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MME

21st Micromechanics and Micro systems Europe Workshop

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HET INSTRUMENT

The Sound of Technology - Hall 1 - booth 1A102

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12. Kolloquium

Werkstoff- und Bauteilprüfung in der Schweißtechnik

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